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This study aims to elucidate the reaction mechanism of electroless NiP deposits on conductive but non-catalytic Cu films on the basis of their nucleation and growth without Pd catalyst and to measure the deposition rate and activation energy of electroless NiP deposits on the non-catalytic Cu film at various deposition times (60, 120, 240 and 480 s) and temperatures (70, 80 and 90°C) at pH 4.6.

Specimens with and without Pd catalyst on Cu film were prepared as follows: the Pd catalyst was deposited on half of the Cu film using a deposition protector, and the specimen containing the Pd catalyst deposited on half of its area was immersed in electroless NiP solution. The growth of NiP on the Cu films with and without the Pd catalyst was observed.

The number of Pd nanoparticles increased with Pd activation time; the nucleation of Pd dominated over growth at 60 s. Lattice images show that the d-spacing of Ni nanoparticles doped with less than 10 at% P increased to 2.050 Å. Nucleation of NiP deposits occurred simultaneously in the specimens with and without the Pd catalyst, because electrons could be transferred via the conductive Cu. Therefore, the reaction mechanism of the electroless NiP deposited on Cu film appears to be electrochemical. The activation energies for NiP deposits (15 s Pd with catalytic Pd, 15 s Pd without catalytic Pd, 60 s Pd with catalytic Pd and 60 s Pd without catalytic Pd) on the Cu film are 65.8, 64.0, 64.3 and 58.1 kJ/mol, respectively. This demonstrates that, regardless of the volume and the presence of catalytic Pd, the activation energy of electroless NiP has a consistent value.

It is necessary to study the relationship between the volume of Pd nanoparticles and the nucleation rate of NiP at an initial stage, as there are limited data regarding the effect of Pd volume on the nucleation rate of NiP.

The reaction mechanism of the electroless NiP deposited on conductive but non-catalytic Cu film involves electrochemical reactions because the nucleation of NiP deposits occurs on conductive Cu film regardless of the presence of the Pd catalyst.